英语词汇mechanical buffing怎么读，是什么意思，单词翻译、读音、固定搭配用法和短语词组及例句-英汉双解词典

网络释义

1
?机械抛光
... mechanical buffing 机械抛光 buffing paste 擦光膏 Buffing dust 磨革革灰 ; 抛光尘 ...

短语

1
Mechanical buffing action
物理性去角质
2
mechanical activation buffing
机械抛光

双语例句

1
Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
2
Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process.
化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。

单词	mechanical buffing
释义	mechanical buffing 简明释义机械抛光网络释义 1 ?机械抛光 ... mechanical buffing 机械抛光 buffing paste 擦光膏 Buffing dust 磨革革灰 ; 抛光尘 ... 短语 1 Mechanical buffing action 物理性去角质 2 mechanical activation buffing 机械抛光双语例句 1 Chemical-Mechanical polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process. 化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。 2 Chemical-Mechanical % polish (CMP) - a process of flattening and polishing wafers that utilizes both chemical removal and mechanical buffing. It is used during the fabrication process. 化学-机械抛光(CMP) -平整和抛光晶圆片的工艺，采用化学移除和机械抛光两种方式。此工艺在前道工艺中使用。
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