After plating with heating except with 1% of the internal stress or plating of sedimentary can avoid this lead a characteristics.
电镀后用加热法除内应力或电镀时与1%的铅共沉积可避免这一特性。
2
After extraction separation of gold by MIBK, lead, copper, iron, nickel in gold plating bath were determined by inductively coupled plasma-atomic emission spectrometry (ICP-AES).