The effects of surface electroplate pure copper on oxidation failure of lead frame copper alloys for ICpackage were investigated.
研究了在铜合金表面电镀纯铜层保护膜对铜合金引线框架氧化失效的影响。
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ICpackage is the smallest unit in electronic systems, compact thermal models of IC packages influence the speed and accuracy of thermal analysis directly.
In addition, the lead and the ICpackage add inductance as well. Multiple capacitors with low ESL (Equivalent Series inductance) should be used to improve the decoupling effect.