The results show that the grain size of tin gradually gets smaller while that of alloy layer gets bigger and bigger with the increasing of current density.
结果表明,随着电流密度的增加,电沉积的锡晶粒度逐渐细化,合金层的晶粒度有变粗的趋势。
3
The result show that tin is distributed on the surface of the sample made by reversing solidification, and the grain is fined, the hardness and resistivity are increased.