The finite element method was used for analysis of heatstress in chip on board(COB).
本文采用有限元法分析了板上芯片(COB)的热应力分布。
2
The finite element method was used for analysis of heatstress in chip on board (COB).
本文采用有限元法分析了板上芯片(COB)的热应力分布。
3
Considering gravity, interfacial shear stress, surface tension and interfacial thermal resistance, the analysis model for annular flow condensation heat transfer in microtube was presented.