Using enthalpy to deal with latent heatofsolidification the numerical model is solved by finite element method, and a steady temperature field can be obtained under a certain condition.
Reflow Soldering: Melting, joining and solidificationof two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
3
The heat transfer and solidification change are analyzed by measuring the temperature change curves of metal mold, casting and pressurized bar in experimental model during local pressurization.