This mix of systems reduces the heatdensity of each rack, potentially allowing for optimal density.
这种混合系统可以减少每个机架的热量密度,并可有望获得最佳的密度。
2
With the increase of chip integration level and packaging density, the heatdensity generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高,计算机发热密度近年来一直呈指数级增长。
3
The data resembles a heat map of population density in a given city at any point in time.