Heatcurable adhesive composition, article, semiconductor apparatus and method.
可热固化粘合剂组合物,制品,半导体器械和方法。
2
DOVER series low temperature curing adhesives are one part, low temperature heatcurable epoxy.
DOVER系列低温固化胶是单组份、低温热固化改良型环氧树脂胶粘剂。
3
This paper discusses a nanometer level precision alignment technique as applied to highly efficient micro optics packaging using heatcurable adhesives.