Gasplasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
2
Objective To explore the effects and damages of low-temperature sterilizing with hydrogen peroxide gasplasma (HPGP) on dental high speed turbine handpieces, so as to prolong its service life.