The hot embossing and bonding machines have been used practically in microfluidic chip automatic fabrication, and the chips have satisfactory quality, precision, repetition and consistency.
塑料微流控芯片热压键合设备已经投入自动化生产，生产的芯片质量、精度、重复性和一致性良好。
2
This article introduced the reprocess of polyamide hot melt adhesive for bonding lining cloth of clothing.
具体介绍了服装粘合衬布用聚酰胺热熔胶的后加工。
3
Bonding process of cold forming with ply pressure is introduced, and compared with hot-press approach.