The present invention relates to a kind of anodeplate and its sputtering apparatus.
本发明涉及一种阳极板及一种包括所述阳极板的溅镀装置。
2
Positioning plate is usually used in fixing the place of anodeplate and cathode plate in electrobath.
定位板主要是用来固定阳、阴极板在电解槽中的位置。
3
When the anodeplate is used in sputtering DLC coating, no wrapping structures are formed in the edges of the substrate and the sputtered coating is firm with less falling off.