Especially, the principles of glasspassivation on silicon devices and processes are described.
特别论述硅器件玻璃钝化的原理和工艺流程。
2
A new method of mesa making model is proposed, and a new way of glasspassivation technique is applied to high voltage and big current thyristor.
提出了台面造型的新方法，实现了在大台面、高电压、大电流晶闸管上采用玻璃钝化技术新的工艺途径。
3
The non-parasitic parameter carrier is superior to the quartz carrier and beam-lead carrier as well as glasspassivation carrier in either performance or strength.