Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.

The heel crash pad absorbs shock on hard surfaces, and the trail Shield layer protects your foot from uneven trail debris.

If the drums will be hit medium to hard, you'll usually want to enable the mic's built-in attenuation (" pad ") switch. This helps minimize the chance of distortion.