ICDie Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
2
The experimental results indicate that the designed parallel mechanism can meet the working requirements of the ICdie bonder and each performance index has reached the design standards.
实验结果表明：所设计的机构能满足IC芯片粘片机的工作要求，各项性能指标均达到了设计标准。
3
An experimental platform of the ICdie bonder has been manufactured, and parameters such as moving precision and position accuracy have been measured by using image recognition technology.