Highdensitypackaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
2
Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with highdensity and good performance.
微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。
3
Traditional forward looping technology is becoming hard to meet high-density requirements of IC Packaging, and reverse looping can comparatively achieve very low loop height.