Highdensity packaging can he achieved by using leadless ceramic chip carriers (LCCCs).
使用无引线陶瓷芯片载体(LCCC)可以达到高密度封装。
2
For fabrication, a thin film process of highdensity routing and multi-chip assembly is adopted to meet the performance and structure requirements.
在制作上，根据性能和结构要求，采用了高密度布线、多芯片组装的薄膜工艺。
3
The card is PCI add card, comprised with the core chip, a highdensityhigh capability FPGA, and the image collect chip, image output chip, PCI bridge chip and the DDR RAM.