To meet the needs of the electronicpackage materials, the thermal properties of the composites were analyzed.
适应电子封装选材的应用背景,对复合材料进行了热学性能分析。
2
With increase in electronicpackage density, the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高,板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
3
Therefore, research on temperature distribution and thermal stress of micro-electronicpackage is very important, which has both theoretical and practical significance.