Our proprietary setup procedures enable us to plate in deep cavities, while maintaining electroform thickness with zero porosity.
我们拥有专利权的设置程序可以进行深腔镀膜，同时在无孔隙的情况下保持电镀厚度。
2
No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.