The copper electrodecouple preparation step prepares the copper electrode couples with a plurality of micrometers of relative spacing by a yellow-light photolithography process.
铜电极偶制备步骤，为利用黄光微影制程制作出相对间距为数微米的铜电极 偶。
2
The invention provides a preparation method of a chip-typed air discharging protection component, comprising a copper electrodecouple preparation step and a hollow air chamber preparation step.