Substrate type suitable for thick film chip resistors automatic fine adjustment.

If you look at a (chip) packet, what you've got is a plastic film, a few layers of inks and a printed metal layer to keep the materials fresh.

Samsung Electronics announced that it has developed the industry's first thermally-enhanced chip-on-film (TECOF) package for the display driver IC (DDI) used in large-screen, high-resolution LCD TVs.