When normal indenting is applied, the thin filmbonding can be tested by this indenter and the results have been compared with that by scratch tests.
采用正压法测定气相沉积薄膜的结合强度并与划痕法作了比较。
2
The product is made with6020polyester thin film coated with bonding agent and compounded with insulation paper.
该产品是有6020聚酯薄膜涂以粘合剂再与绝缘纸复合而成。
3
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.