电子、通信与自动控制技术

• 曝光

  Uniformity of the photoresist film, adhesiveness between underlay and glue film, exposal and develop condition of high thickness difference are all solved in the thesis. During the course of electro form process, we got ideal electro form process condition that can get windings with uniform granule and high compactness, including current waveform, frequency, duty ratio and voltage to the windings ect.

  在厚胶光刻工艺中重点解决了胶膜厚度的均匀性、胶膜与衬底的粘附性、大厚度差胶层的曝光、显影条件等的优化问题。