The monolithic integration and hybridintegration technology used for HgCdTe infrared detector is researched.
介绍了单片集成硅光接收器的研究背景，阐述了硅光电探测器的工作机理。
2
Sensor and signal regulating circuit is carried out through hybrid packaging by making use of thick-film circuit technology, which realizes integration and minimization of sensor.
将传感器与信号调节电路利用厚膜电路工艺进行混合封装，完成了传感器的一体化，实现了传感器的小型化。
3
The hybrid convolution symbolized the integration of analytical convolution and numerical convolution.