英语词汇flip chip bump怎么读，是什么意思，单词翻译、读音、固定搭配用法和短语词组及例句-英汉双解词典

单词	flip chip bump
释义	flip chip bump 简明释义倒装芯片隆起焊盘：指在倒装芯片封装中，芯片与基板之间的连接点，通常为金属球形焊盘。网络释义 1 ?倒装芯片隆起焊盘 ... flip chip bonding 倒装焊接 flip chip bump 倒装芯片隆起焊盘 flip chip carrier 倒装芯片座 ... 2 ?倒装片凸点 ... flip chip attach (FCA) 倒装芯片贴装，倒装芯片附着 flip chip bump 倒装片凸点，倒装片对准点 flip chip in package 倒装片封装 ... 双语例句 1 With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating. 本实验显示经过最佳化的传输线路设计与凸块分布，低成本高效能的覆晶封装结构目标可以达成。
随便看	byte handling facility byte identify byte increment BYTE Information Exchange byte in page byte in page byte instruction byte instructions byte-interleaved byte-interleaved mode byte interleaving by telegram by telegraph by telephone byte level differencing byte machine byte manipulation byte mask byte memory byte memory address byte mode byte monitor by tempering byte multiplex channel byte multiplexer

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